Datasheet
Datasheet 3
ContentsContents
1Introduction............................................................................................................11
1.1 Terminology .....................................................................................................12
1.1.1 Processor Packaging Terminology.............................................................12
1.2 References .......................................................................................................13
2 Electrical Specifications...........................................................................................15
2.1 Power and Ground Lands....................................................................................15
2.2 Decoupling Guidelines........................................................................................15
2.2.1 V
CC
Decoupling ......................................................................................15
2.2.2 V
TT
Decoupling ......................................................................................15
2.2.3 FSB Decoupling......................................................................................16
2.3 Voltage Identification.........................................................................................16
2.4 Reserved, Unused, and TESTHI Signals ................................................................18
2.5 Voltage and Current Specification........................................................................19
2.5.1 Absolute Maximum and Minimum Ratings ..................................................19
2.5.2 DC Voltage and Current Specification........................................................20
2.5.3 VCC Overshoot ......................................................................................24
2.5.4 Die Voltage Validation.............................................................................25
2.6 Signaling Specifications......................................................................................25
2.6.1 FSB Signal Groups..................................................................................26
2.6.2 GTL+ Asynchronous Signals.....................................................................28
2.6.3 Processor DC Specifications .....................................................................28
2.6.3.1 GTL+ Front Side Bus Specifications .............................................31
2.7 Clock Specifications...........................................................................................32
2.7.1 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking............................32
2.7.2 FSB Frequency Select Signals (BSEL[2:0]).................................................32
2.7.3 Phase Lock Loop (PLL) and Filter ..............................................................33
2.7.4 BCLK[1:0] Specifications.........................................................................35
3 Package Mechanical Specifications ..........................................................................37
3.1 Package Mechanical Drawing...............................................................................37
3.2 Processor Component Keep-Out Zones.................................................................41
3.3 Package Loading Specifications ...........................................................................41
3.4 Package Handling Guidelines...............................................................................41
3.5 Package Insertion Specifications..........................................................................41
3.6 Processor Mass Specification...............................................................................42
3.7 Processor Materials............................................................................................42
3.8 Processor Markings............................................................................................42
3.9 Processor Land Coordinates................................................................................43
4 Land Listing and Signal Descriptions .......................................................................45
4.1 Processor Land Assignments...............................................................................45
4.2 Alphabetical Signals Reference............................................................................70
5 Thermal Specifications and Design Considerations ..................................................81
5.1 Processor Thermal Specifications.........................................................................81
5.1.1 Thermal Specifications............................................................................81
5.1.2 Thermal Metrology .................................................................................85
5.2 Processor Thermal Features................................................................................85
5.2.1 Thermal Monitor.....................................................................................85
5.2.2 On-Demand Mode ..................................................................................86
5.2.3 PROCHOT# Signal..................................................................................86
5.2.4 FORCEPR# Signal...................................................................................87