Datasheet
Balanced Technology Extended (BTX) Boxed Processor Specifications
102 Datasheet
NOTE: The duct, clip, heatsink and fan can differ from this drawing representation but
the basic shape and size will remain the same.
8.1 Mechanical Specifications
8.1.1 Balanced Technology Extended (BTX) Type I and Type II
Boxed Processor Cooling Solution Dimensions
This section documents the mechanical specifications of the boxed Intel processor TMA.
The boxed processor will be shipped with an unattached TMA. Figure 27 shows a
mechanical representation of the boxed processor in the 775-land LGA package for
Type I TMA. Figure 28 shows a mechanical representation of the boxed processor in the
775-land LGA package for Type II TMA. The physical space requirements and
dimensions for the boxed processor with assembled fan thermal module are shown.
Figure 26. Mechanical Representation of the Boxed Processor with a Type II TMA