Datasheet

4 Datasheet
5.2.5 T
CONTROL
and Fan Speed Reduction ...........................................................81
5.2.6 Thermal Diode........................................................................................81
6 Features....................................................................................................................85
6.1 Power-On Configuration Options ..........................................................................85
6.2 Clock Control and Low Power States.....................................................................85
6.2.1 Normal State .........................................................................................86
6.2.2 HALT and Enhanced HALT Powerdown States..............................................86
6.2.2.1 HALT Powerdown State ..............................................................87
6.2.2.2 Enhanced HALT Powerdown State................................................87
6.2.3 Stop Grant State ....................................................................................87
6.2.4 Enhanced HALT Snoop or HALT Snoop State,
Stop Grant Snoop State...........................................................................88
6.2.4.1 HALT Snoop State, Stop Grant Snoop State ..................................88
6.2.4.2 Enhanced HALT Snoop State.......................................................88
7 Boxed Processor Specifications .....................................................................................89
7.1 Mechanical Specifications....................................................................................89
7.1.1 Boxed Processor Cooling Solution Dimensions.............................................89
7.1.2 Boxed Processor Fan Heatsink Weight .......................................................91
7.1.3 Boxed Processor Retention Mechanism and Heatsink
Attach Clip Assembly...............................................................................91
7.2 Electrical Requirements ......................................................................................91
7.2.1 Fan Heatsink Power Supply ......................................................................91
7.3 Thermal Specifications........................................................................................93
7.3.1 Boxed Processor Cooling Requirements......................................................93
8 Debug Tools Specifications...........................................................................................95
8.1 Logic Analyzer Interface (LAI) .............................................................................95
8.1.1 Mechanical Considerations .......................................................................95
8.1.2 Electrical Considerations..........................................................................95