Datasheet

Package Mechanical Specifications
38 Datasheet
3.5 Package Insertion Specifications
The Celeron D processor can be inserted into and removed from a LGA775 socket 15
times. The socket should meet the LGA775 requirements detailed in the LGA775 Socket
Mechanical Design Guide.
3.6 Processor Mass Specification
The typical mass of the Celeron D processor is 21.5 g [0.76 oz]. This mass [weight]
includes all the components that are included in the package.
3.7 Processor Materials
Table 22 lists some of the package components and associated materials.
3.8 Processor Markings
Figure 8 shows the topside markings on the processor. This diagram is to aid in the
identification of the Celeron D processor.
Table 22. Processor Materials
Component Material
Integrated Heat Spreader (IHS) Nickel Plated Copper
Substrate Fiber Reinforced Resin
Substrate Lands Gold Plated Copper
Figure 8. Processor Top-Side Marking Example
ATPO
S/N
Processor Number/ S-Spec/
Country of Assy
INTEL
XXXXXXXX
3.33GHZ/512K/533/05A
356 SLxxx [COO]
[FPO]
m
©
‘05
Frequency/L2 Cache/Bus/FMB
FPO
2-D Matrix Mark
Unique Unit
Identifier
ATPO Serial #
Brand