Datasheet

38 Datasheet
Package Mechanical Specifications
3.1.5 Package Insertion Specifications
The Pentium 4 processor in the 775-land package can be inserted into and removed from a
LGA775 socket 15 times. The socket should meet the LGA775 requirements detailed in the
LGA775 Socket Mechanical Design Guide.
3.1.6 Processor Mass Specification
The typical mass of the Pentium 4 processor in the 775-land package is 21.5 g [0.76 oz]. This mass
[weight] includes all the components that are included in the package.
3.1.7 Processor Materials
Table 3-3 lists some of the package components and associated materials.
3.1.8 Processor Markings
Figure 3-5 shows the topside markings on the processor. These diagrams are to aid in the
identification of the Pentium 4 processor in the 775-land package.
Table 3-3. Processor Materials
Component Material
Integrated Heat Spreader (IHS) Nickel Plated Copper
Substrate Fiber Reinforced Resin
Substrate Lands Gold Plated Copper
Figure 3-5. Processor Top-Side Markings
ATPO
S/N
INTEL m © ‘04
Pentium® 4
3.60GHZ/1M/800/04B
SLxxx [COO]
[FPO]