Datasheet

Datasheet 5
Contents
Figures
2-1 VCC Static and Transient Tolerance for 775_VR_CONFIG_05A Pentium D Processor............22
2-2 VCC Static and Transient Tolerance for 775_VR_CONFIG_05B Pentium D Processor............24
2-3 VCC Overshoot Example Waveform ..........................................................................................25
2-4 Phase Lock Loop (PLL) Filter Requirements..............................................................................34
3-1 Processor Package Assembly Sketch........................................................................................35
3-2 Processor Package Drawing 1 ...................................................................................................36
3-3 Processor Package Drawing 2 ...................................................................................................37
3-4 Processor Package Drawing 3 ...................................................................................................38
3-5 Processor Top-Side Marking Example (Intel
®
Pentium
®
D Processors 840, 830, 820).............40
3-6 Processor Top-Side Marking Example (Intel
®
Pentium
®
D Processor 805)...............................41
3-7 Processor Land Coordinates, Top View .....................................................................................42
4-1 Landout Diagram (Top View – Left Side)....................................................................................44
4-2 Landout Diagram (Top View – Right Side) .................................................................................45
5-1 Thermal Profile for the Pentium D Processor with PRB=1 .........................................................77
5-2 Thermal Profile for the Pentium D Processor with PRB=0 .........................................................78
5-3 Case Temperature (TC) Measurement Location ........................................................................79
6-1 Processor Low Power State Machine.........................................................................................86
7-1 Mechanical Representation of the Boxed Processor..................................................................89
7-2 Side View Space Requirements for the Boxed Processor (Applies to all four side views) .........90
7-3 Top View Space Requirements for the Boxed Processor...........................................................90
7-4 Overall View Space Requirements for the Boxed Processor .....................................................91
7-5 Boxed Processor Fan Heatsink Power Cable Connector Description ........................................92
7-6 Baseboard Power Header Placement Relative to Processor Socket .........................................93
7-7 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 1 view) ........................94
7-8 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 2 view) ........................94
7-9 Boxed Processor Fan Heatsink Set Points.................................................................................95
8-1 Mechanical Representation of the Boxed Processor..................................................................97
8-2 Requirements for the Balanced Technology Extended (BTX) Type I Keep-out Volumes ..........98
8-3 Assembly Stack Including the Support and Retention Module...................................................99
8-4 Boxed Processor Fan Heatsink Power Cable Connector .........................................................100
8-5 Balanced Technology Extended (BTX) Mainboard Power Header Placement (hatched area) 101
8-6 Boxed Processor TMA Set Points ............................................................................................102