Datasheet

4 Datasheet
Contents
5.2 Processor Thermal Features ..............................................................................................79
5.2.1 Thermal Monitor.....................................................................................................79
5.2.2 On-Demand Mode .................................................................................................80
5.2.3 PROCHOT# Signal................................................................................................ 80
5.2.4 FORCEPR# Signal Pin..........................................................................................81
5.2.5 THERMTRIP# Signal.............................................................................................82
5.2.6 T
CONTROL
and Fan Speed Reduction....................................................................82
5.2.7 Thermal Diode ....................................................................................................... 82
6 Features ........................................................................................................................................85
6.1 Power-On Configuration Options........................................................................................85
6.2 Clock Control and Low Power States .................................................................................85
6.2.1 Normal State..........................................................................................................86
6.2.2 HALT and Enhanced HALT Powerdown States ....................................................86
6.2.3 Stop-Grant State.................................................................................................... 87
6.2.4 Enhanced HALT Snoop or HALT Snoop State, Grant Snoop State......................88
6.2.5 Enhanced Intel SpeedStep
®
Technology ..............................................................88
7 Boxed Processor Specifications.................................................................................................... 89
7.1 Mechanical Specifications ..................................................................................................90
7.1.1 Boxed Processor Cooling Solution Dimensions ....................................................90
7.1.2 Boxed Processor Fan Heatsink Weight................................................................. 91
7.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly.......91
7.2 Electrical Requirements......................................................................................................91
7.2.1 Fan Heatsink Power Supply ..................................................................................91
7.3 Thermal Specifications .......................................................................................................93
7.3.1 Boxed Processor Cooling Requirements...............................................................93
7.3.2 Variable Speed Fan...............................................................................................95
8 Balanced Technology Extended (BTX) Type I Boxed Processor Specifications...........................97
8.1 Mechanical Specifications ..................................................................................................98
8.1.1 Cooling Solution Dimensions.................................................................................98
8.1.2 Boxed Processor Fan Heatsink Weight................................................................. 98
8.1.3 Boxed Processor Support and Retention Module (SRM) ...................................... 99
8.2 Electrical Requirements......................................................................................................99
8.2.1 Fan Heatsink Power Supply ..................................................................................99
8.3 Thermal Specifications .....................................................................................................101
8.3.1 Boxed Processor Cooling Requirements.............................................................101
8.3.2 Variable Speed Fan.............................................................................................102
9 Debug Tools Specifications.........................................................................................................105
9.1 Logic Analyzer Interface (LAI) ..........................................................................................105
9.1.1 Mechanical Considerations..................................................................................105
9.1.2 Electrical Considerations .....................................................................................105