Datasheet

Functional Description
178 Intel® Xeon® Processor D-1500 Product Family
Datasheet - Volume 1 of 4: Integrated Platform Controller Hub
March 2015
Although an 8-pin device is preferred over a 16-pin device due to footprint
compatibility, the following table contains the recommended serial flash device pin-out
for a 16-pin SOIC.
3.23.8 Serial Flash Device Package
3.23.8.1 Common Footprint Usage Model
In order to minimize platform motherboard redesign and to enable platform Bill of
Material (BOM) selectability, many PC System OEMs design their motherboard with a
single common footprint. This common footprint allows population of a soldered down
device or a socket that accepts a leadless device. This enables the board manufacturer
to support, using selection of the appropriate BOM, either of these solutions on the
same system without requiring any board redesign.
The common footprint usage model is desirable during system debug and by flash
content developers since the leadless device can be easily removed and reprogrammed
without damage to device leads. When the board and flash content is mature for high-
volume production, both the socketed leadless solution and the soldered down leaded
solution are available through BOM selection.
3.23.8.2 Serial Flash Device Package Recommendations
It is highly recommended that the common footprint usage model be supported. An
example of how this can be accomplished is as follows:
• The recommended pinout for 8-pin serial flash devices is used (see
Section 3.23.7).
Table 3-55. Recommended Pinout for 8-Pin Serial Flash Device
Pin # Signal
1Chips Select
2 Data Output
3Write Protect
4Ground
5 Data Input
6Serial Clock
7Hold / Reset
8Supply Voltage
Table 3-56. Recommended Pinout for 16-Pin Serial Flash Device
Pin # Signal Pin # Signal
1 Hold / Reset 9 Write Protect
2 Supply Voltage 10 Ground
3 No Connect 11 No Connect
4 No Connect 12 No Connect
5 No Connect 13 No Connect
6 No Connect 14 No Connect
7 Chip Select 15 Serial Data In
8 Serial Data Out 16 Serial Clock