Datasheet
Datasheet, Volume 1 5
4.2.4.4 Core C6 State........................................................................... 49
4.2.4.5 Core C7 State........................................................................... 49
4.2.4.6 C-State Auto-Demotion.............................................................. 50
4.2.5 Package C-States ................................................................................... 50
4.2.5.1 Package C0 .............................................................................. 51
4.2.5.2 Package C1/C1E ....................................................................... 52
4.2.5.3 Package C3 State...................................................................... 52
4.2.5.4 Package C6 State...................................................................... 52
4.2.5.5 Package C7 State...................................................................... 53
4.2.5.6 Dynamic L3 Cache Sizing ........................................................... 53
4.3 Integrated Memory Controller (IMC) Power Management ........................................53
4.3.1 Disabling Unused System Memory Outputs ................................................ 53
4.3.2 DRAM Power Management and Initialization ............................................... 54
4.3.2.1 Initialization Role of CKE ............................................................ 55
4.3.2.2 Conditional Self-Refresh............................................................. 55
4.3.2.3 Dynamic Power-down Operation ................................................. 56
4.3.2.4 DRAM I/O Power Management .................................................... 56
4.4 PCI Express* Power Management ........................................................................ 56
4.5 Direct Media Interface (DMI) Power Management .................................................. 56
4.6 Graphics Power Management .............................................................................. 57
4.6.1 Intel
®
Rapid Memory Power Management (Intel
®
RMPM)
(also known as CxSR) ............................................................................. 57
4.6.2 Intel
®
Graphics Performance Modulation Technology (Intel
®
GPMT) ..............57
4.6.3 Graphics Render C-State ......................................................................... 57
4.6.4 Intel
®
Smart 2D Display Technology (Intel
®
S2DDT) .................................. 58
4.6.5 Intel
®
Graphics Dynamic Frequency.......................................................... 58
4.6.6 Display Power Savings Technology 6.0 (DPST) ........................................... 58
4.6.7 Automatic Display Brightness (ADB).......................................................... 59
4.6.8 Intel
®
Seamless Display Refresh Rate Switching Technology (Intel
®
SDRRS
Technology) .......................................................................................... 59
4.7 Thermal Power Management ............................................................................... 59
5 Thermal Management .............................................................................................. 61
5.1 Thermal Design Power (TDP) and Junction Temperature (Tj) ................................... 61
5.2 Thermal Considerations...................................................................................... 61
5.2.1 Intel
®
Turbo Boost Technology Power Control and Reporting........................ 62
5.2.2 Package Power Control............................................................................ 63
5.2.3 Power Plane Control................................................................................ 63
5.2.4 Turbo Time Parameter ............................................................................ 63
5.3 Thermal and Power Specifications........................................................................ 64
5.4 Thermal Management Features ........................................................................... 67
5.4.1 Processor Package Thermal Features......................................................... 67
5.4.1.1 Adaptive Thermal Monitor .......................................................... 68
5.4.1.2 Digital Thermal Sensor .............................................................. 70
5.4.1.3 PROCHOT# Signal..................................................................... 71
5.4.2 Processor Core Specific Thermal Features .................................................. 73
5.4.2.1 On-Demand Mode .....................................................................73
5.4.3 Memory Controller Specific Thermal Features ............................................. 73
5.4.3.1 Programmable Trip Points .......................................................... 73
5.4.4 Platform Environment Control Interface (PECI) ........................................... 74
5.4.4.1 Fan Speed Control with Digital Thermal Sensor ............................. 74
6 Signal Description ................................................................................................... 75
6.1 System Memory Interface Signals........................................................................ 76
6.2 Memory Reference and Compensation Signals ....................................................... 77
6.3 Reset and Miscellaneous Signals.......................................................................... 78
6.4 PCI Express*-Based Interface Signals .................................................................. 79