Datasheet

Thermal Specifications
76 Datasheet
details on this feature, refer to Section 5.2. Thermal Monitor 1 and Thermal
Monitor 2 feature must be enabled for the processor to remain within its
specifications.
NOTES:
1. These values are specified at V
CC_MAX
for all processor frequencies. Systems must be
designed to ensure the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at specified I
CC
. Refer to the loadline
specifications in Section 2.13.
2. Thermal Design Power (TDP) should be used for the processor thermal solution design
targets. TDP is not the maximum power that the processor can dissipate. TDP is measured
at maximum T
CASE
.
3. These specifications are based on silicon characterization.
4. Power specifications are defined at all VIDs found in Table 2-3. The processor may be
shipped under multiple VIDs for each frequency.
5. The processor s intended for dual processor workstations only.
NOTES:
1. Refer to Table 5-2 for discrete points that constitute the thermal profile.
2. Implementation of the processor Thermal Profile should result in virtually no TCC
activation. Furthermore, utilization of thermal solutions that do not meet the processor
Thermal Profile will result in increased probability of TCC activation and may incur
measurable performance loss. Refer to the appropriate processor Thermal and Mechanical
Design Guidelines (see Section 1.2) for system and environmental implementation details.
Table 5-1. Processor Thermal Specifications
Core
Frequency
Maximum
Power
(W)
Thermal
Design Power
(W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
QX9775 155 150 5
See
Figure 5-1;
Table 5-2
1,2,3,4,5
Figure 5-1. Processor Thermal Profile
Thermal Profile (2U)
35
40
45
50
55
60
65
70
75
0 102030405060708090100110120130140150
Power [W]
Tcase [C]
Thermal Profile
Y = 0.187*x + 35
Thermal Profile (2U)
35
40
45
50
55
60
65
70
75
0 102030405060708090100110120130140150
Power [W]
Tcase [C]
Thermal Profile
Y = 0.187*x + 35