Datasheet

Datasheet 25
Electrical Specifications
NOTES:
1. For functional operation, all processor electrical, signal quality, mechanical and thermal
specifications must be satisfied.
2. Excessive overshoot or undershoot on any signal will likely result in permanent damage to
the processor.
3. Storage temperature is applicable to storage conditions only. In this scenario, the
processor must not receive a clock, and no lands can be connected to a voltage bias.
Storage within these limits will not affect the long-term reliability of the device. For
functional operation, please refer to the processor case temperature specifications.
4. This rating applies to the processor and does not include any tray or packaging.
5. Failure to adhere to this specification can affect the long-term reliability of the processor.
2.13 Processor DC Specifications
The processor DC specifications in this section are defined at the processor die
(pads) unless noted otherwise. See Chapter 4 for the processor land listings and
signal definitions. Voltage and current specifications are detailed in Table 2-12. For
platform planning refer to Table 2-13, which provides V
CC
static and transient
tolerances. This same information is presented graphically in Figure 2-3.
The FSB clock signal group is detailed in Table 2-19. BSEL[2:0] and VID[6:1] signals
are specified in Table 2-14. The DC specifications for the AGTL+ signals are listed in
Table 2-15. Legacy signals and Test Access Port (TAP) signals follow DC specifications
similar to GTL+. The DC specifications for the PWRGOOD input and TAP signal group
are listed in Table 2-15.
Table 2-12 through Table 2-17 list the DC specifications for the processor and are valid
only while meeting specifications for case temperature (T
CASE
as specified in Chapter 5,
“Thermal Specifications”), clock frequency, and input voltages. Care should be taken to
read all notes associated with each parameter.
Table 2-11. Processor Absolute Maximum Ratings
Symbol Parameter Min Max Unit Notes
1, 2
V
CC
Core voltage with respect to V
SS
-0.30 1.35 V
V
TT
FSB termination voltage with respect to V
SS
-0.30 1.45 V
T
CASE
Processor case temperature
See
Chapter 5
See
Chapter 5
°C
T
STORAGE
Storage temperature -40 85 °C3, 4, 5