Datasheet

Datasheet 11
Introduction
two processor agents. The DIB architecture provides improved performance by
allowing increased FSB speeds and bandwidth.
• Functional Operation – Refers to the normal operating conditions in which all
processor specifications, including DC, AC, FSB, signal quality, mechanical and
thermal are satisfied.
• Storage Conditions – Refers to a non-operational state. The processor may be
installed in a platform, in a tray, or loose. Processors may be sealed in packaging or
exposed to free air. Under these conditions, processor lands should not be
connected to any supply voltages, have any I/Os biased or receive any clocks.
Upon exposure to “free air” (that is, unsealed packaging or a device removed from
packaging material) the processor must be handled in accordance with moisture
sensitivity labeling (MSL) as indicated on the packaging material.
• Priority Agent – The priority agent is the host bridge to the processor and is
typically known as the chipset.
• Symmetric Agent – A symmetric agent is a processor which shares the same I/O
subsystem and memory array, and runs the same operating system as another
processor in a system. Systems using symmetric agents are known as Symmetric
Multiprocessing (SMP) systems.
• Integrated Heat Spreader (IHS) – A component of the processor package used
to enhance the thermal performance of the package. Component thermal solutions
interface with the processor at the IHS surface.
• Thermal Design Power (TDP) – Processor thermal solutions should be designed
to meet this target. It is the highest expected sustainable power while running
known power intensive applications. TDP is not the maximum power that the
processor can dissipate.
• Intel
®
64 Architecture – An enhancement to Intel's IA-32 architecture that allows
the processor to execute operating systems and applications written to take
advantage of the 64-bit extension technology.
• Enhanced Intel SpeedStep
®
Technology – Technology that provides power
management capabilities to servers and workstations.
• Platform Environment Control Interface (PECI) – A proprietary one-wire bus
interface that provides a communication channel between Intel processor and
external thermal monitoring devices, for use in fan speed control. PECI
communicates readings from the processor’s digital thermometer. PECI replaces
the thermal diode available in previous processors.
• Intel
®
Virtualization Technology – Processor virtualization, which when used in
conjunction with Virtual Machine Monitor software enables multiple, robust
independent software environments inside a single platform.
• VRM (Voltage Regulator Module) – DC-DC converter built onto a module that
interfaces with a card edge socket and supplies the correct voltage and current to
the processor based on the logic state of the processor VID bits.
• EVRD (Enterprise Voltage Regulator Down) – DC-DC converter integrated onto
the system board that provides the correct voltage and current to the processor
based on the logic state of the processor VID bits.
• V
CC
– The processor core power supply.
• V
SS
– The processor ground.
• V
TT
– FSB termination voltage.