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Thermal and Mechanical Design Guidelines 7
Figure 7-27. Solder Station Setup ....................................................................... 98
Figure 7-28. View Through Lens at Solder Station ................................................. 99
Figure 7-29. Moving Solder back onto Thermocouple Bead ..................................... 99
Figure 7-30. Removing Excess Solder ................................................................ 100
Figure 7-31. Thermocouple placed into groove ................................................... 101
Figure 7-32. Removing Excess Solder ................................................................ 101
Figure 7-33. Filling Groove with Adhesive .......................................................... 102
Figure 7-34. Application of Accelerant ............................................................... 102
Figure 7-35. Removing Excess Adhesive from IHS .............................................. 103
Figure 7-36. Finished Thermocouple Installation ................................................. 103
Figure 7-37. Thermocouple Wire Management .................................................... 104
Figure 7-38. System Airflow Illustration with System Monitor Point Area Identified . 106
Figure 7-39. Thermal sensor Location Illustration ............................................... 107
Figure 7-40. ATX/µATX Motherboard Keep-out Footprint Definition and Height
Restrictions for Enabling Components - Sheet 1 ........................................... 112
Figure 7-41. ATX/µATX Motherboard Keep-out Footprint Definition and Height
Restrictions for Enabling Components - Sheet 2 ........................................... 113
Figure 7-42. ATX/µATX Motherboard Keep-out Footprint Definition and Height
Restrictions for Enabling Components - Sheet 3 ........................................... 114
Figure 7-43. BTX Thermal Module Keep Out Volumetric – Sheet 1 ......................... 115
Figure 7-44. BTX Thermal Module Keep Out Volumetric – Sheet 2 ......................... 116
Figure 7-45. BTX Thermal Module Keep Out Volumetric – Sheet 3 ......................... 117
Figure 7-46. BTX Thermal Module Keep Out Volumetric – Sheet 4 ......................... 118
Figure 7-47. BTX Thermal Module Keep Out Volumetric – Sheet 5 ......................... 119
Figure 7-48. ATX Reference Clip – Sheet 1 ......................................................... 120
Figure 7-49. ATX Reference Clip - Sheet 2 ......................................................... 121
Figure 7-50. Reference Fastener - Sheet 1 ......................................................... 122
Figure 7-51. Reference Fastener - Sheet 2 ......................................................... 123
Figure 7-52. Reference Fastener - Sheet 3 ......................................................... 124
Figure 7-53. Reference Fastener - Sheet 4 ......................................................... 125
Figure 7-54. Intel
®
E18764-001 Reference Solution Assembly .............................. 126