Datasheet

6 Thermal and Mechanical Design Guidelines
Figures
Figure 2-1. Package IHS Load Areas ................................................................... 15
Figure 2-2. Processor Case Temperature Measurement Location ............................. 19
Figure 2-3. Example Thermal Profile.................................................................... 20
Figure 3-1. Processor Thermal Characterization Parameter Relationships ................. 28
Figure 3-2. Locations for Measuring Local Ambient Temperature, Active ATX Heatsink31
Figure 3-3. Locations for Measuring Local Ambient Temperature, Passive Heatsink ... 31
Figure 4-1. Thermal Monitor Control.................................................................... 35
Figure 4-2. Thermal Monitor 2 Frequency and Voltage Ordering .............................. 36
Figure 4-3. T
CONTROL
for Digital Thermal Sensor ..................................................... 39
Figure 5-1. Effective TMA Fan Curves with Reference Extrusion .............................. 44
Figure 5-2. Random Vibration PSD ...................................................................... 46
Figure 5-3. Shock Acceleration Curve .................................................................. 46
Figure 5-4. Intel Type II TMA 65W Reference Design ............................................. 49
Figure 5-5. Upward Board Deflection During Shock ............................................... 50
Figure 5-6. Minimum Required Processor Preload to Thermal Module Assembly
Stiffness .................................................................................................... 51
Figure 5-7. Thermal Module Attach Pointes and Duct-to-SRM Interface Features ....... 52
Figure 6-1. E18764-001 Reference Design – Exploded View ................................... 54
Figure 6-2. Bottom View of Copper Core Applied by TC-1996 Grease ....................... 54
Figure 6-3. Random Vibration PSD ...................................................................... 58
Figure 6-4. Shock Acceleration Curve .................................................................. 58
Figure 6-5. Upward Board Deflection during Shock ................................................ 62
Figure 6-6. Reference Clip/Heatsink Assembly ...................................................... 63
Figure 6-7. Critical Parameters for Interfacing to Reference Clip ............................. 64
Figure 6-8. Critical Core Dimension ..................................................................... 64
Figure 7-1. Intel
®
QST Overview ........................................................................ 66
Figure 7-2. PID Controller Fundamentals ............................................................. 67
Figure 7-3. Intel
®
QST Platform Requirements ..................................................... 68
Figure 7-4. Example Acoustic Fan Speed Control Implementation ........................... 69
Figure 7-5. Digital Thermal Sensor and Thermistor ............................................... 70
Figure 7-6. Board Deflection Definition ................................................................ 73
Figure 7-7. Example—Defining Heatsink Preload Meeting Board Deflection Limit ....... 75
Figure 7-8. Load Cell Installation in Machined Heatsink Base Pocket – Bottom View .. 78
Figure 7-9. Load Cell Installation in Machined Heatsink Base Pocket – Side View ...... 79
Figure 7-10. Preload Test Configuration ............................................................... 79
Figure 7-11. Omega Thermocouple ..................................................................... 86
Figure 7-12. 775-LAND LGA Package Reference Groove Drawing at 6 o’clock Exit ..... 88
Figure 7-13. 775-LAND LGA Package Reference Groove Drawing at 3 o’clock Exit
(Old Drawing) ............................................................................................ 89
Figure 7-14. IHS Groove at 6 o’clock Exit on the 775-LAND LGA Package ................ 90
Figure 7-15. IHS Groove at 6 o’clock Exit Orientation Relative to the LGA775 Socket 90
Figure 7-16. Inspection of Insulation on Thermocouple .......................................... 91
Figure 7-17. Bending the Tip of the Thermocouple ................................................ 92
Figure 7-18. Securing Thermocouple Wires with Kapton* Tape Prior to Attach .......... 92
Figure 7-19. Thermocouple Bead Placement ......................................................... 93
Figure 7-20. Position Bead on the Groove Step ..................................................... 94
Figure 7-21. Detailed Thermocouple Bead Placement ............................................ 94
Figure 7-22. Third Tape Installation .................................................................... 95
Figure 7-23. Measuring Resistance between Thermocouple and IHS ........................ 95
Figure 7-24. Applying Flux to the Thermocouple Bead ........................................... 96
Figure 7-25. Cutting Solder ................................................................................ 96
Figure 7-26. Positioning Solder on IHS ................................................................ 97