Datasheet

Thermal and Mechanical Design Guidelines 5
7.3 Intel
®
QST Configuration and Tuning ........................................................ 70
7.4 Fan Hub Thermistor and Intel
®
QST ......................................................... 70
Appendix A LGA775 Socket Heatsink Loading ........................................................................ 71
A.1 LGA775 Socket Heatsink Considerations ................................................... 71
A.2 Metric for Heatsink Preload for ATX/uATX Designs Non-Compliant with Intel
®
Reference Design ................................................................................... 71
A.3 Heatsink Preload Requirement Limitations ................................................. 71
A.3.1 Motherboard Deflection Metric Definition...................................... 72
A.3.2 Board Deflection Limits .............................................................. 73
A.3.3 Board Deflection Metric Implementation Example ......................... 74
A.3.4 Additional Considerations........................................................... 75
A.3.4.1 Motherboard Stiffening Considerations ......................... 76
A.4 Heatsink Selection Guidelines .................................................................. 76
Appendix B Heatsink Clip Load Metrology ............................................................................. 77
B.1 Overview .............................................................................................. 77
B.2 Test Preparation .................................................................................... 77
B.2.1 Heatsink Preparation ................................................................. 77
B.2.2 Typical Test Equipment ............................................................. 80
B.3 Test Procedure Examples ........................................................................ 80
B.3.1 Time-Zero, Room Temperature Preload Measurement ................... 81
B.3.2 Preload Degradation under Bake Conditions ................................. 81
Appendix C Thermal Interface Management .......................................................................... 83
C.1 Bond Line Management .......................................................................... 83
C.2 Interface Material Area ........................................................................... 83
C.3 Interface Material Performance ................................................................ 83
Appendix D Case Temperature Reference Metrology ............................................................... 85
D.1 Objective and Scope............................................................................... 85
D.2 Supporting Test Equipment ..................................................................... 85
D.3 Thermal Calibration and Controls ............................................................. 87
D.4 IHS Groove ........................................................................................... 87
D.5 Thermocouple Attach Procedure ............................................................... 91
D.5.1 Thermocouple Conditioning and Preparation ................................. 91
D.5.2 Thermocouple Attachment to the IHS .......................................... 92
D.5.3 Solder Process ......................................................................... 97
D.5.4 Cleaning and Completion of Thermocouple Installation ................ 100
D.6 Thermocouple Wire Management ........................................................... 104
Appendix E Balanced Technology Extended (BTX) System Thermal Considerations .................. 105
Appendix F Fan Performance for Reference Design .............................................................. 109
Appendix G Mechanical Drawings ....................................................................................... 111
Appendix H Intel
®
Enabled Reference Solution Information ................................................... 127