Datasheet

4 Thermal and Mechanical Design Guidelines
4.2.6 System Considerations .............................................................. 37
4.2.7 Operating System and Application Software Considerations ........... 38
4.2.8 THERMTRIP# Signal .................................................................. 38
4.2.9 Cooling System Failure Warning ................................................. 38
4.2.10 Digital Thermal Sensor .............................................................. 39
4.2.11 Platform Environmental Control Interface (PECI) .......................... 40
5 Balanced Technology Extended (BTX) Thermal/Mechanical Design Information ......... 41
5.1 Overview of the BTX Reference Design ..................................................... 41
5.1.1 Target Heatsink Performance ..................................................... 41
5.1.2 Acoustics ................................................................................. 42
5.1.3 Effective Fan Curve ................................................................... 43
5.1.4 Voltage Regulator Thermal Management ...................................... 44
5.1.5 Altitude ................................................................................... 45
5.1.6 Reference Heatsink Thermal Validation ........................................ 45
5.2 Environmental Reliability Testing ............................................................. 45
5.2.1 Structural Reliability Testing ...................................................... 45
5.2.1.1 Random Vibration Test Procedure ................................ 45
5.2.1.2 Shock Test Procedure ................................................. 46
5.2.2 Power Cycling .......................................................................... 47
5.2.3 Recommended BIOS/CPU/Memory Test Procedures ...................... 48
5.3 Material and Recycling Requirements........................................................ 48
5.4 Safety Requirements .............................................................................. 49
5.5 Geometric Envelope for Intel Reference BTX Thermal Module Assembly ........ 49
5.6 Preload and TMA Stiffness ....................................................................... 50
5.6.1 Structural Design Strategy ......................................................... 50
5.6.2 TMA Preload verse Stiffness ....................................................... 50
6 ATX Thermal/Mechanical Design Information ........................................................ 53
6.1 ATX Reference Design Requirements ........................................................ 53
6.2 Validation Results for Reference Design .................................................... 55
6.2.1 Heatsink Performance ............................................................... 55
6.2.2 Acoustics ................................................................................. 56
6.2.3 Altitude ................................................................................... 56
6.2.4 Heatsink Thermal Validation ....................................................... 57
6.3 Environmental Reliability Testing ............................................................. 57
6.3.1 Structural Reliability Testing ...................................................... 57
6.3.1.1 Random Vibration Test Procedure ................................ 57
6.3.1.2 Shock Test Procedure ................................................. 58
6.3.2 Power Cycling .......................................................................... 59
6.3.3 Recommended BIOS/CPU/Memory Test Procedures ...................... 60
6.4 Material and Recycling Requirements........................................................ 60
6.5 Safety Requirements .............................................................................. 61
6.6 Geometric Envelope for Intel Reference ATX Thermal Mechanical Design ...... 61
6.7 Reference Attach Mechanism ................................................................... 62
6.7.1 Structural Design Strategy ......................................................... 62
6.7.2 Mechanical Interface to the Reference Attach Mechanism .............. 63
7 Intel
®
Quiet System Technology (Intel
®
QST) ...................................................... 65
7.1 Intel
®
QST Algorithm .............................................................................. 65
7.1.1 Output Weighting Matrix ............................................................ 66
7.1.2 Proportional-Integral-Derivative (PID) ......................................... 66
7.2 Board and System Implementation of Intel
®
QST ....................................... 68