Datasheet

Thermal and Mechanical Design Guidelines 3
Contents
1 Introduction ..................................................................................................... 11
1.1 Document Goals and Scope ..................................................................... 11
1.1.1 Importance of Thermal Management ........................................... 11
1.1.2 Document Goals ....................................................................... 11
1.1.3 Document Scope ...................................................................... 12
1.2 References ............................................................................................ 13
1.3 Definition of Terms................................................................................. 13
2 Processor Thermal/Mechanical Information .......................................................... 15
2.1 Mechanical Requirements ........................................................................ 15
2.1.1 Processor Package .................................................................... 15
2.1.2 Heatsink Attach ........................................................................ 17
2.1.2.1 General Guidelines ..................................................... 17
2.1.2.2 Heatsink Clip Load Requirement .................................. 17
2.1.2.3 Additional Guidelines .................................................. 18
2.2 Thermal Requirements ........................................................................... 18
2.2.1 Processor Case Temperature ...................................................... 18
2.2.2 Thermal Profile ......................................................................... 19
2.2.3 Thermal Solution Design Requirements ....................................... 19
2.2.4 T
CONTROL
................................................................................... 20
2.3 Heatsink Design Considerations ............................................................... 21
2.3.1 Heatsink Size ........................................................................... 22
2.3.2 Heatsink Mass .......................................................................... 22
2.3.3 Package IHS Flatness ................................................................ 23
2.3.4 Thermal Interface Material ......................................................... 23
2.4 System Thermal Solution Considerations .................................................. 24
2.4.1 Chassis Thermal Design Capabilities ............................................ 24
2.4.2 Improving Chassis Thermal Performance ..................................... 24
2.4.3 Summary ................................................................................ 25
2.5 System Integration Considerations ........................................................... 25
3 Thermal Metrology ............................................................................................ 27
3.1 Characterizing Cooling Performance Requirements ..................................... 27
3.1.1 Example .................................................................................. 28
3.2 Processor Thermal Solution Performance Assessment ................................. 29
3.3 Local Ambient Temperature Measurement Guidelines ................................. 29
3.4 Processor Case Temperature Measurement Guidelines ................................ 32
4 Thermal Management Logic and Thermal Monitor Feature ...................................... 33
4.1 Processor Power Dissipation .................................................................... 33
4.2 Thermal Monitor Implementation ............................................................. 33
4.2.1 PROCHOT# Signal .................................................................... 34
4.2.2 Thermal Control Circuit ............................................................. 34
4.2.2.1 Thermal Monitor ........................................................ 34
4.2.3 Thermal Monitor 2 .................................................................... 35
4.2.4 Operation and Configuration ...................................................... 36
4.2.5 On-Demand Mode ..................................................................... 37