Data Sheet

ManualsBrandsIntel ManualsDevelopment Kit Add-onsDevelopment board 1 pc(s)

Thermal and Mechanical Injury

Certain components such as heat sinks, power regulators, and processors may be hot.

Heatsink fans are not guarded. Power supply fan may be accessible through guard.

Care should be taken to avoid contact with these components.

Cooling Requirements

Maintain a minimum clearance area of 5 centimeters (2 inches) around the side, front

and back of the board for cooling purposes. Do not block power supply ventilation

holes and fan.

Electro-Magnetic Interference (EMI)

This equipment has not been tested for compliance with emission limits of FCC and

similar international regulations. Use of this equipment in a residential location is

prohibited. This equipment generates, uses and can radiate radio frequency energy

which may result in harmful interference to radio communications. If this equipment

does cause harmful interference to radio or television reception, which can be

determined by turning the equipment on and off, the user is required to take

measures to eliminate this interference.

Telecommunications Port Restrictions

The wireline telecommunications ports (modem, xDSL, T1/E1) on this product must

not be connected to the Public Switched Telecommunication Network (PSTN) as it

might result in disruption of the network. No formal telecommunication certification to

FCC, R&TTE Directive, or other national requirements have been obtained.

A Safety and Regulatory Information

UG-20082 | 2018.02.05

Intel

Cyclone

10 LP FPGA Evaluation Kit User Guide

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