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4.3 MAX 10 System Controller Overview

The highlights of the Intel MAX 10 devices include:

• Internally stored dual configuration flash

• User flash memory

• Instant on support

• Integrated analog-to-digital converter (ADC)

• Single-chip Nios II soft core processor support

Intel MAX 10 devices are the ideal solution for system management, I/O expansion,

communication control planes, industrial, automotive, and consumer applications.

Table 7. Summary of Features for Intel MAX 10 Devices

Feature Description

Technology 55 nm TSMC Embedded Flash (Flash + SRAM) process technology

Packaging • Low cost, small form factor packages—support multiple packaging

technologies and pin pitches

• Multiple device densities with compatible package footprints for seamless

migration between different device densities

• RoHS6-compliant

Core architecture • 4-input look-up table (LUT) and single register logic element (LE)

• LEs arranged in logic array block (LAB)

• Embedded RAM and user flash memory

• Clocks and PLLs

• Embedded multiplier blocks

• General purpose I/Os

Internal memory blocks • M9K—9 kilobits (Kb) memory blocks

• Cascadable blocks to create RAM, dual port, and FIFO functions

User flash memory (UFM) • User accessible non-volatile storage

• High speed operating frequency

• Large memory size

• High data retention

• Multiple interface option

Embedded multiplier blocks • One 18 × 18 or two 9 × 9 multiplier modes

• Cascadable blocks enabling creation of filters, arithmetic functions, and image

processing pipelines

ADC • 12-bit successive approximation register (SAR) type

• Up to 16 analog inputs

• Cumulative speed up to 1 million samples per second (MSPS)

• Integrated temperature sensing capability

Clock networks • Global clocks support

• High speed frequency in clock network

Internal oscillator Built-in internal ring oscillator

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4 Evaluation Board Components

UG-20082 | 2018.02.05

Intel

Cyclone

10 LP FPGA Evaluation Kit User Guide

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