Document

Integration Guide for New Dual-Core Intel
®
Xeon
®
Processor-Based Servers (or Workstations) Rev 1.
8
3.2 Fully Buffered DIMM (FBDIMM) Memory
Fully Buffered DIMM (FBDIMM) memory provides increased bandwidth and capacity for new Dual-Core
Intel® Xeon® processor-based servers. It increases system bandwidth up to 21GB/s (with DDR2-667
FBD memory), and increased memory capacity up to 64GB in a 4 channel 16 DIMM server system.
FBDIMM memory has different versions in terms of the DRAM used in the memory module: DDR2-533
FBD memory and DDR2-667 FBD memory, and has different capacities: 512MB, 1GB, 2GB and 4GB.
DIMM pairs must be identical with respect to size, speed and manufacturer.
The picture below illustrates an example of an FBDIMM.
Figure 3.2.2 FBDIMM Example
USEFUL INTEGRATION TIPS
1) To take advantage of the Intel® E5000P chipset, Intel recommends using at least 4 FBDIMMs in new
Dual-Core Intel
®
Xeon
®
processor-based servers to achieve optimal throughput. Example: For 2GB
configurations use 4 x 512M FBDIMMs rather than 2 x 1GB FBDIMMs.
2) To boot up the system, one FBDIMM should be installed in the first FBDIMM slot.
3) Intel has completed FBDIMM validation for different memory configurations. System integrators can
find the complete list of tested memory modules at:
http://developer.intel.com/technology/memory/
3.3 Processor and Thermal Solutions
The boxed version of the Dual-Core Intel
®
Xeon
®
processor 5000 sequence supports a passive 2U+
thermal solution, as well as a combination active/1U passive solution (as figure 3.3.1 and 3.3.2 shows).
The 2U passive solution can be used in 2U+ rack chassis and pedestal systems; the active solution is a
combined solution that supports pedestal chassis with the fan attached, and 1U rack systems with the fan
removed (as figure 3.3.3 shows).