Vol 1

Intel® Xeon® Processor E7-8800/4800/2800 v2 Product Family 5
Datasheet Volume One, February 2014
6.10 AC Specifications...............................................................................................93
6.10.1 Signal AC Specifications ..........................................................................93
6.11 AC Timing Waveforms........................................................................................97
6.12 Signal Quality................................................................................................. 106
6.12.1 SMI2 Signal Quality Specifications .......................................................... 106
6.12.2 I/O Signal Quality Specifications............................................................. 107
6.12.3 Intel
®
QuickPath Interconnect Signal Quality Specifications ....................... 107
6.12.4 Input Reference Clock Signal Quality Specifications................................... 107
6.12.5 Overshoot/Undershoot Tolerance............................................................ 107
7 Processor Land Listing........................................................................................... 109
7.1 Listing by Land Name ...................................................................................... 109
7.2 Listing by Land Number ................................................................................... 134
8 Package Mechanical Specifications ........................................................................ 159
8.1 Package Mechanical Drawing............................................................................. 159
8.2 Processor Component Keep-Out Zones............................................................... 163
8.3 Package Loading Specifications ......................................................................... 163
8.4 Package Handling Guidelines............................................................................. 163
8.5 Package Insertion Specifications........................................................................ 163
8.6 Processor Mass Specification............................................................................. 164
8.7 Processor Materials.......................................................................................... 164
8.8 Processor Markings.......................................................................................... 164
9PIROM................................................................................................................... 165
9.1 Processor Information ROM .............................................................................. 165
9.1.1 Processor Information ROM Table........................................................... 165
9.1.2 Scratch EEPROM .................................................................................. 167
9.1.3 PIROM and Scratch EEPROM Supported SMBus Transactions ...................... 167
9.2 SMBus Memory Component Addressing.............................................................. 168
9.3 Managing Data in the PIROM............................................................................. 168
9.3.1 Header ............................................................................................... 169
9.3.2 Processor Data..................................................................................... 172
9.3.3 Processor Core Data ............................................................................. 174
9.3.4 Processor Uncore Data.......................................................................... 177
9.3.5 Package Data ...................................................................................... 181
9.3.6 Part Number Data ................................................................................ 182
9.3.7 Thermal Reference Data........................................................................ 184
9.3.8 Feature Data ....................................................................................... 185
9.3.9 Electronic Signature.............................................................................. 188
9.3.10 Checksums.......................................................................................... 188
Figures
1-1 Intel® Xeon® E7 v2 Processor on a 2 Socket Platform...........................................12
1-2 Intel® Xeon® E7 v2 Processor on a 4 Socket Platform...........................................12
1-3 Intel® Xeon® E7 v2 Processor on a 8 Socket Platform...........................................13
3-1 Idle Power Management Breakdown of the Processor Cores.....................................35
3-2 Thread and Core C-State Entry and Exit ...............................................................35
3-3 Package C-State Entry and Exit...........................................................................39
4-1 Tcase: 155W Thermal Profile ..............................................................................46
4-2 DTS: 155W 15 Core Thermal Profile.....................................................................47
4-3 DTS: 155W 10 Core Thermal Profile.....................................................................48
4-4 DTS: 155W 6 Core Thermal Profile.......................................................................49
4-5 Tcase: 130W Thermal Profile ..............................................................................51
4-6 DTS: 130W 12-15 Core Thermal Profile................................................................52
4-7 Tcase: 105W Thermal Profile ..............................................................................54