Guidelines

R
4 Intel
®
E7500 MCH Thermal and Mechanical Design Guidelines
Figures
Figure 1. Thermal Design Process......................................................................................8
Figure 2. Intel
®
E7500 MCH Package Dimensions (Side View) ........................................11
Figure 3. Intel
®
E7500 MCH Package Dimensions (Top View) .........................................12
Figure 4. 90° Angle Attach Methodology ...........................................................................18
Figure 5. 0° Angle Attach Methodology (Top View)...........................................................19
Figure 6. 0° Angle Attach Heatsink Modifications..............................................................19
Figure 7. Thermal Solution Decision Flowchart.................................................................20
Figure 8. Reference Heatsink Volumetric Envelope for the Intel
®
MCH............................22
Figure 9. Reference Thermal Solution Assembly..............................................................23
Figure 10. Reference Thermal Solution Assembly (Side View).........................................24
Figure 11. Reference Thermal Solution (Top View) ..........................................................24
Figure 12. Preferred Heatsink Orientation.........................................................................25
Figure 13. Extruded Heatsink Profile.................................................................................26
Figure 14. Alternate Tall Heatsink Profile ..........................................................................26
Figure 15. Heatsink Mechanical Gasket, Optional Two-Piece ..........................................27
Figure 16. Heatsink Retention Mechanism Layout............................................................28
Figure 17. Retention Mechanism Component Keep-out Zones ........................................29
Figure 18. Intel
®
MCH Heatsink Assembly ........................................................................34
Figure 19. Intel
®
MCH Heatsink Clip..................................................................................35
Tables
Table 1. Intel
®
E7500 MCH Thermal Specifications ..........................................................15
Table 2. Reliability Requirements ......................................................................................30
Table 3. Complete Thermal Solution Kits ..........................................................................31
Table 4. Extruded Heatsinks .............................................................................................31
Table 5. Interface Materials ...............................................................................................32
Table 6. Attach Hardware..................................................................................................32