Guidelines

R
Intel
®
E7500 MCH Thermal and Mechanical Design Guidelines 3
Contents
1 Introduction..........................................................................................................................7
1.1 Design Flow ............................................................................................................8
1.2 Definition of Terms..................................................................................................9
1.3 Reference Documents ..........................................................................................10
2 Packaging Technology ......................................................................................................11
3 Thermal Simulation............................................................................................................13
4 Thermal Specifications ......................................................................................................15
4.1 Power....................................................................................................................15
4.2 Die Temperature...................................................................................................15
5 Thermal Metrology.............................................................................................................17
5.1 Die Temperature Measurements..........................................................................17
5.1.1 90° Angle Attach Methodology ..............................................................17
5.1.2 0° Angle Attach Methodology ................................................................18
5.2 Power Simulation Software...................................................................................20
6 Reference Thermal Solutions............................................................................................21
6.1 Operating Environment .........................................................................................21
6.2 Mechanical Design Envelope................................................................................21
6.3 Thermal Solution Assembly ..................................................................................23
6.3.1 Heatsink Orientations............................................................................25
6.3.2 Extruded Heatsink Profiles....................................................................26
6.3.3 Mechanical Interface Material ...............................................................27
6.3.4 Thermal Interface Material ....................................................................27
6.3.5 Heatsink Clip .........................................................................................27
6.3.6 Clip Retention Anchors..........................................................................28
6.3.7 Board Level Component Keep-out Dimensions ....................................28
6.4 Reliability Requirements .......................................................................................30
Appendix A: Thermal Solution Component Suppliers ............................................................................31
Appendix B: Mechanical Drawings.........................................................................................................33