Guidelines

Intel
®
7500 Chipset Thermal Mechanical Design Guide 9
Packaging Technology
2 Packaging Technology
The Intel 7500 chipset component uses a 37.5 mm, 8-layer flip chip ball grid array
(FC-BGA) package (see Figure 2-1, Figure 2-2, and Figure 2-3).
Solder Ball composition on IOH is SAC 405 with the following percentage:
Note: BGA has a pre-SMT height of 0.5+/-0.1mm. Top of the die above the motherboard after
reflow is 2.36+/-0.24 mm.
Table 2-1. Solder Ball Composition on Intel® 7500 chipset
Composition Percentage
Ag 4%
Cu 0.5%
Sn 95.5%
Figure 2-1. IOH Package Dimensions (Top View)
Die
37.5 mm.
37.5 mm.
13.8 mm.
10.6 mm
Handling
Exclusion
Area