Guidelines

Reference Thermal Solution
26 Intel
®
7500 Chipset Thermal Mechanical Design Guide
6.5 Tall Torsional Clip Heatsink Thermal Solution
Assembly
The reference thermal solution for the IOH is a passive extruded heatsink with thermal
interface. It is attached using a clip with each end hooked through an anchor soldered
to the board. Figure 6-5 shows the reference thermal solution assembly and associated
components.
Full mechanical drawings of the thermal solution assembly and the heatsink clip are
provided in Appendix B. Appendix A contains vendor information for each thermal
solution component.
Figure 6-3. Tall Torsional Clip Heatsink Board Component Keepout