Guide

Thermal and Mechanical Design
42 Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family
Thermal/ Mechanical Specifications and Design Guide
9. Minimum Tcase represents the lowest processor operating temperature.
2.2.3 Thermal Metrology
2.2.3.1 Case Temperature
The minimum and maximum case temperatures (T
CASE
) specified in Table 2-10 are
measured at the geometric center of the processor substrate on top of the processor
integrated heat spreader (IHS).
Figure 2-24 contains dimensions for the thermocouple location on the processor
package. Note that thermocouple location is centered with respect to the processor
package substrate, but is offset with respect to center of IHS. This is due to location
offset between the IHS and package substrate. This is the recommended location for
the placement of a thermocouple for case temperature measurement.
Multi-core processors may exhibit higher temperature on the IHS at the locations
coinciding with the core locations. Because of the IHS thermal power spreading effect,
delta temperature between the core location and IHS center may diminish at the lower
power. Component thermal solution designers may utilize IHS power gradient at the
core locations to optimize the processor cooling solution or to verify the thermal
solution capability in meeting the processor thermal requirement.
Note: See the processor package drawing for the feature dimensions.
2.2.3.2 DTS Based Thermal Specification
2.2.3.2.1 DTS Based Thermal Profile, Tcontrol and Margin
Calculation of the DTS based thermal specification is based on both Tcontrol and the
DTS Based Thermal Profile (T
DTS
):
Figure 2-24. Processor Package Thermocouple Location
T
CASE
Measurement
Point