Vol 1

Intel® Xeon® Product 2800/4800/8800 v2 Product Family 159
Datasheet Volume One, February 2014
Package Mechanical Specifications
8 Package Mechanical
Specifications
The Intel® Xeon® E7v2 processor is packaged in a Flip-Chip Land Grid Array
(FCLGA10) package that interfaces with the baseboard via an LGA2011-1 socket. The
package consists of a processor mounted on a substrate land-carrier. An integrated
heat spreader (IHS) is attached to the package substrate and core and serves as the
mating surface for processor component thermal solutions, such as a heatsink.
Figure 8-1 shows a sketch of the processor package components and how they are
assembled together. Refer to the Intel® Xeon® Processor E7-2800/4800/8800 v2
Processor Family Thermal/Mechanical Design Guide for complete details on the
LGA2011-1 socket.
The package components shown in Figure 8-1 include the following:
1. Integrated Heat Spreader (IHS)
2. Thermal Interface Material (TIM)
3. Processor core (die)
4. Package substrate
5. Capacitors
Note:
1. Socket and baseboard are included for reference and are not part of processor package.
8.1 Package Mechanical Drawing
The package mechanical drawings are shown in Figure 8-2 and Figure 8-3. The
drawings include dimensions necessary to design a thermal solution for the processor.
These dimensions include:
1. Package reference with tolerances (total height, length, width, and so forth)
2. IHS parallelism and tilt
3. Land dimensions
4. Top-side and back-side component keep-out dimensions
5. Reference datums
Figure 8-1. Processor Package Assembly Sketch
IHS
Substrate
System Board
Capacitors
TIM
LGA2011-0 Socket
Die