Guidelines

Dual-Core Intel
®
Xeon
®
Processor 7000 Sequence Thermal /Mechanical Guidelines 3
Contents
1 Introduction.........................................................................................................................7
1.1 Objective ...............................................................................................................7
1.2 Scope ....................................................................................................................7
1.3 References ............................................................................................................7
1.4 Definition of Terms ................................................................................................8
2 Thermal Mechanical Design.............................................................................................11
2.1 Mechanical Requirements...................................................................................11
2.1.1 Processor Mechanical Parameters ........................................................11
2.1.2 Mechanical Dimensions .........................................................................12
2.1.3 Mechanical Considerations ....................................................................14
2.2 Processor Thermal Parameters and Features ....................................................15
2.2.1 Thermal Control Circuit and TDP ...........................................................15
2.2.2 Dual Core Special Considerations .........................................................16
2.2.3 Thermal Profile.......................................................................................18
2.2.4 TCONTROL Definition............................................................................20
2.2.5 Performance Targets..............................................................................21
2.3 Characterizing Cooling Solution Performance Requirements .............................22
2.3.1 Fan Speed Control .................................................................................22
2.3.2 Processor Thermal Characterization Parameter
Relationships..........................................................................................23
2.3.3 Chassis Thermal Design Considerations ...............................................25
2.4 Thermal/Mechanical Reference Design Considerations .....................................26
2.4.1 Heatsink Solutions..................................................................................26
2.4.2 Thermal Interface Material .....................................................................26
2.4.3 Summary................................................................................................27
2.4.4 Assembly Overview of the Intel Reference Thermal
Mechanical Design .................................................................................27
2.4.5 Thermal Solution Performance Characteristics......................................29
2.4.6 Thermal Profile Adherence.....................................................................31
2.4.7 Components Overview ...........................................................................32
A Mechanical Drawings .......................................................................................................35
B Safety Requirements........................................................................................................49
C Quality and Reliability Requirements ...............................................................................51
C.1 Intel Verification Criteria for the Reference Designs ...........................................51
C.1.1 Reference Heatsink Thermal Verification...............................................51
C.1.2 Environmental Reliability Testing ...........................................................51
C.1.3 Material and Recycling Requirements....................................................53
D Supplier Information .........................................................................................................55
D.1 Intel Enabled Suppliers .......................................................................................55