Guide

Thermal and Mechanical Design

Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family 13

Thermal/ Mechanical Specifications and Design Guide

2 Thermal and Mechanical Design

In this section, mechanical and thermal requirements of the processor as well as its

enabling solution are discussed. These specifications will enable a designer to identify

and establish set of design requirements for the motherboard and the system in

addressing compliance with the processor and the enabled components specifications.

2.1 Mechanical Requirements

The mechanical performance of the processor retention and thermal solution are to

satisfy the requirements and volumetric keep-outs of the processor and the LGA2011-1

socket, as described in this section to ensure compatibility with the processor and

the platform.

2.1.1 Processor Package Mechanical Specifications

2.1.1.1 Processor Package Description

The processor is housed in an Flip-Chip Land Grid Array (FC-LGA10) package that

interfaces with the motherboard via an LGA2011-1 SMT socket. The package consists

of a processor integrated heat spreader (IHS), which is attached to the package

substrate and die and serves as the mating surface for the processor component

thermal solutions, such as a heatsink. The bottom side of the package has 2011 lands,

a 43.18 x 50.24 mm pad array which interfaces with the LGA2011-1 SMT socket.

Figure 2-1 shows a sketch of the processor package components and how they are

assembled together.

The package components include the following:

1. Processor Die

2. Package Substrate

3. TIM - Thermal Interface Material, also known as TIM1

4. Integrated Heat Spreader (IHS)

5. LGA lands (LGA2011-1 socket interface)

6. Decoupling and server management components (top side)

7. Discrete components (bottom side)

Note: This drawing is not to scale and is for reference only. The socket is not shown.

Figure 2-1. Processor Package Assembly Sketch