Vol 1

Intel® Xeon® Product 2800/4800/8800 v2 Product Family 53
Datasheet Volume One, February 2014
Thermal Management Specifications
4.1.3.3 105W Thermal Specifications
Notes:
1. These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at
specified ICC.
2. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3. These specifications are based on initial pre-silicon simulations, which will be updated as further
characterization data becomes available.
4. Power specifications are defined at all VIDs. The Intel® Xeon® E7v2 processor may be delivered under
multiple VIDs for each frequency.
5. FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
90 65.6 72.5
95 66.5 73.8
100 67.5 75.2
105 68.4 76.5
110 69.3 77.8
115 70.2 79.1
120 71.2 80.4
125 72.1 81.7
130 73.0 83
Table 4-6. Tcase: 105W Thermal Specifications
Thermal Design
Power (W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
105 5 See Figure 4-7 and
Table 4-7
1, 2, 3, 4, 5
Table 4-5. 130W Thermal Profile Table (Sheet 2 of 2)
Power (W) Max T
CASE
(°C) 12-15 Core Max DTS (°C)