Guidelines

Thermal Mechanical Design
16 Dual-Core Intel
®
Xeon
®
Processor 7000 Sequence Thermal /Mechanical Guidelines
On-die thermal management features called THERMTRIP# and FORCEPTR# are available on the
Dual-Core Intel Xeon processor 7000 sequence. They provide a thermal management approach to
support the continued increases in processor frequency and performance.
Note: Please see the Dual-Core Intel® Xeon® Processor 7000 Sequence Electrical, Mechanical, and
Thermal Specifications for guidance on these thermal management features.
2.2.2 Dual Core Special Considerations
2.2.2.1 Thermal Monitor for Dual Die and Dual Core Products
The thermal management for dual die and dual core products do not change from previous
generations. There will still be only one Tcontrol value (see section Section 2.2.4 for Tcontrol
definition), and if either diode temperature is greater than or equal to Tcontrol, the processor case
temperature must remain at or below the temperature as specified by the thermal profile. See
Figure 2-3 for a visual depiction of the difference between dual die and dual core processors. The
Dual-Core Intel Xeon processor 7000 sequence is a dual core product utilizing two physical Intel
NetBurst® microarchitecture cores in one package.
NOTE: Figure not to scale. For reference only.
Figure 2-3. Dual Core vs. Dual Die