Guide

Thermal and Mechanical Design
Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family 45
Thermal/ Mechanical Specifications and Design Guide
M > 0; margin to spec, fan speed may decrease
Use of RdPkgConfig(), Index 10 with an Intel® Xeon® Processor E7 2800/4800/8800
v2 Product Family will return an illegal command.
For the follow-on processor, coefficients (α
f
, α
s
) and scale factor (C) as defined in
Section 2.2.3.2.3, will be programmable and available via a register. If the two time
constant average specification (T
DTS_ave
) is not desired, set α
f
= 1.0 and C = 1.0 to
force T
DTS_ave
= T
DTS_max
.
For the follow-on processor, Tcontrol_offset as defined in Section 2.3.3, can be
programmed via a register.
2.2.4 Processor Thermal Solution Performance Targets
Processor heatsink design must comply with the Tcase based thermal profile. System
that do not monitor the processor die temperature by monitoring the thermal sensor
output must ensure processor cooling solution is capable of meeting the processor
based Tcase spec. In some situations, implementation of DTS based thermal
specification can reduce average fan power and improve acoustics as compared to the
Tcase based thermal profile.
When all cores are active, a properly sized heatsink will be able to meet the processor
thermal specification. When all cores are not active or when Intel
®
Turbo Boost
Technology is active, attempting to comply with the DTS based thermal specification
may drive system fans to increased speed. In such situations, the T
CASE
temperature
will be below the T
CASE
based thermal profile by design.
Table 2-12 provides thermal boundary conditions and performance targets. These
values serve as guide for designing a process compatible thermal solution.
Notes:
1. Heatsink Ψ
CA_MAX
is for the highest processor core count within the specified power SKU.
Table 2-11. Averaging Coefficients
Heatsink
Performance
α
f
(1/s) α
s
(1/s) C Comment
Low 1.0 0.05 0.32 based on typical processor
Medium 1.0 0.07 0.38 based on typical processor
High 1.0 0.29 0.49 based on typical processor
TTV Coefficients 1.0 0.07 0.55 based on TTV
Table 2-12. Heatsink Boundary Conditions and Performance Targets
Parameter Value Notes
TDP (W) 155 130 105
T
LA
(
o
C) 47 1
Ψ
CA_MAX
(
o
C/W) 0.197 0.200 0.200 1,3,6,7
System height
(form factor)
4U
4
Heatsink volumetric
Overall: 95x105.5x100 (WxLXH)
Base 70x105.5x10.1 (WxLxH)
Fins: 95x70 (WxL)
5
Heatsink
Technology
Cu/Al base / Al fins / heatpipes