Guide

Thermal and Mechanical Design
16 Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family
Thermal/ Mechanical Specifications and Design Guide
load-bearing surface in either static or dynamic compressive load conditions
is not recommended.
2.1.1.4 Processor Component Keep-Out Zones
The processor may contain components on the substrate that define component
keep-out zone requirements. A thermal and mechanical solution design must not
intrude into the required keep-out zones. Decoupling capacitors are typically mounted
on either the topside or land-side of the package substrate. See processor package
mechanical drawing for location, size, and additional information on keep-out zones.
The location and quantity of package capacitors may change due to manufacturing
efficiencies but will remain within the component keep-in areas.
2.1.1.5 Package Insertion Specifications
The processor can be inserted into and removed from an LGA2011-1 socket 15 times.
The socket should meet the LGA2011-1 requirements detailed in the Section 2.1.2.
2.1.1.6 Processor Mass Specification
The typical mass of the processor is ~50 grams. This mass [weight] includes all the
components that are included in the package.
2.1.1.7 Processor Materials
Table 2-2 lists some of the package components and associated materials.
2.1.1.8 Processor Markings
Figure 2-4 shows the topside markings on the processor. This diagram is to aid in the
identification of the processor.
XXXXX = Country of Origin
Table 2-2. Processor Materials
Component Material
Integrated Heat Spreader (IHS) Nickel Plated Copper
Substrate Halogen Free, Fiber Reinforced Resin
Substrate Lands Gold Plated Copper
Figure 2-4. Processor Top-Side Markings
Legend: Mark Text (Production Mark ):
GRP1LINE1: i{M}{C}YY
GRP1LINE2: SUB-BRAND PROC#
GRP1LINE3: SSPEC SPEED
GRP1LINE4: XXXXX
GRP1LINE5: {FPO} {e4}