Guide

Thermal and Mechanical Design
Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family 15
Thermal/ Mechanical Specifications and Design Guide
2.1.1.2 Processor Mechanical Dimensions
The package includes an integrated heat spreader (IHS). The IHS transfers the non-
uniform heat from the die to the top of the IHS, out of which the heat flux is more
uniform and spread over a larger surface area (not the entire IHS area). This allows
more efficient heat transfer out of the package to an attached cooling device. The IHS
is designed to be the interface for contacting a heatsink.
The processor connects to the baseboard through a surface-mount-type LGA socket. A
description of the socket can be found in Section 2.1.2.
Note: Processor package land count is greater than the socket contact count.
The processor package mechanical drawings are provided in the Appendix D as a
reference. The processor package mechanical drawings include dimensions necessary
to design a thermal solution for the processor. These dimensions will include:
1. Package reference with tolerances (total height, length, width, and so on)
2. IHS parallelism and tilt
3. Land dimensions
4. Top-side and back-side component keep-out dimensions
5. Reference datum
2.1.1.3 Processor Mechanical Loads
The processor package has mechanical load limits should not be exceeded during the
processor ILM actuation, heatsink installation and removal, mechanical stress testing,
or standard shipping conditions as permanent damage to the processor may occur. For
example, when a compressive static load is necessary to ensure thermal performance
of the Thermal Interface Material (TIM2) between the heatsink base and the IHS, it
should not exceed the corresponding specification. The processor substrate should not
be used as a mechanical reference or load-bearing surface for thermal solutions.
Notes:
1. Shear load that can be applied to the package IHS.
2. Tensile load that can be applied to the package IHS.
3. Torque that can be applied to the package IHS.
4. Duration of the load not to exceed one second (1 s).
5. These specifications apply to uniform compressive loading in a direction normal to the processor IHS.
6. Dynamic loading is defined as an 11 ms duration average load superimposed on the static
load requirement.
The heatsink and ILM mass will also add additional dynamic compressive load to the
package during a mechanical shock event. Amplification factors due to the impact force
during shock must be taken into account in dynamic load calculations. The total
combination of dynamic and static compressive load should not then exceed the
processor compressive dynamic load specified in the process datasheet and in
Table 2-1 during a vertical shock. Using any portion of the processor substrate as a
Table 2-1. Processor Mechanical Parameters
Parameter Value Unit Notes
Max Allowable Static Compressive Load 1068 N 5
Max Allowable Dynamic Compressive Load 589 N 4, 5, 6
Shear Load (max) 36.3 kg 1
Tensile Load (max) 15.9 kg 2
Torsion Load (max) 15.9 kg-cm 3