Guide

Mechanical Drawings
106 Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family
Thermal/ Mechanical Specifications and Design Guide
Figure G-15. Processor 4U Heatsink Base Cap Mechanical Drawing - E95299 Rev A
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4
5678
B C D
A
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4
5678
B C D
A
2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119
R
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0.1
B
C
A
C
B
C
A
B
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TYP R2
E95299 1 A
DWG. NO SHT. REV
SHEET 1 OF 1
DO NOT SCALE DRAWING
SCALE: 1:1
AE95299D
REV
DRAWING NUMBER
SIZE
BRICKLAND EX HSINK CU BASE
TITLE
PTMI
DEPARTMENT
SEE NOTESSEE NOTES
FINISHMATERIAL -- DATEAPPROVED BY -- -- DATECHECKED BY 7/8/11T. BOYD DATEDRAWN BY 7/8/11T. BOYD DATEDESIGNED BY
UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5M-1994 DIMENSIONS ARE IN MM TOLERANCES: .X ± 0.5 Angles ± 0.5 ° .XX ± 0.25 .XXX ± 0.125
THIRD ANGLE PROJECTION
PARTS LIST
DESCRIPTIONPART NUMBER
ITEM NO
QTY
-G20944-001TOP
REVISION HISTORY
ZONE REV DESCRIPTION DATE APPR
- A PRELIMINARY DRAFT FOR REVIEW 7/8/11 TAB
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
7
NOTES UNLESS OTHERWISE SPECIFIED: 1. REFERENCE DOCUMENTS ASME Y14.5M-1994 - STANDARD DIMENSION AND TOLERANCES UL 94 - UL FLAMABILITY TESTING 99-0007-001 - INTEL WORKMANSHIP STANDARD - SYSTEMS MANUFACTURING 18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR SUPPLIERS & OUTSOURCED MANUFACTURERS (FOUND ON EHS WEBSITE - https://supplier.intel.com/static/EHS/) 07-070-SHS - ADDENDUM FOR SOLDER ON HEATSINKS 2. 3D PART MODEL IS PER ENGINEERING BILL OF MATERIAL. DIMENSIONS CALLED OUT ON THE DRAWING SHALL CONFORM TO THE DEFAULT TOLERANCE BLOCK UNLESS OTHERISE SPECIFIED. THE 3D MODEL SHALL CONTROL ALL FEATURES OF THIS PART NOT DEFINED ON THE DRAWING. MODEL TO BE INTERPRETED USING DATUM A (PRIMARY), DATUM B (SECONDARY), AND DATUM C (TERTIARY) PER THE DRAWING CALLOUT. 3. MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT A) TYPE: COPPER ALLOY (REPORT ALLOY IN FAI STUDY) B) MINIMUM THERMAL CONDUCTIVITY: 390 W/mK 4. PART TO BE CAST, EXTRUDED, MACHINED, OR A COMBINATION. IF PART IS CAST, REFER TO THE FOLLOWING REQUIREMENTS: A) DEGATE: .13 MM [.005 IN] MAXIMUM B) FLASH & MISMATCH .13 MM [.005 IN] MAXIMUM C) SINK .13 MM [.005 IN] MAXIMUM D) EJECTOR MARKS: FLUSH TO MINUS .00 MM/-.25 MM [.000 IN/-.010 IN] 5. CRITICAL TO FUNCTION DIMENSION (CTF)
MEASURED
6 FINISH: MAY USE ENGINEERING APPROVED EQUIVALENT.
A) INDICATED SURFACES PER INTEL 99-0007-001, CLASS A. B) INDICATED SURFACES PER INTEL 99-0007-001, CLASS B. C) UNSPECIFIED SURFACES PER INTEL 99-0007-001, CLASS C. D) TEXTURE INDICATED SURFACES PER MT-11020. E) FINISH INDICATED SURFACES PER SPI D-2. F) SURFACES WITH NO TEXTURE TO BE IN THE RANGE OF SPI B-2 TO SPI C-2. G) NO TEXTURE.
7 HEAT PIPE AND ALUMINUM BASE INTERFACE FEATURES TO BE CONTROLLED BY SUPPLIER.
N6 SURFACE FINISH
ON ENTIRE INDICATED SURFACE
1
1
Intel® Xeon® Processor E7 V2 Product Family-based Platform HSINK CU BASE