Guide

Mechanical Drawings
104 Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family
Thermal/ Mechanical Specifications and Design Guide
Figure G-13. Processor 4U Heatsink Heatpipe Mechanical Drawing - E42883 Rev 1
13
4
5678
B C D
A
123
4
5678
B C D
A
AA
2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119
R
E42883 1 1
DWG. NO SHT. REV
SHEET 1 OF 1DO NOT SCALE DRAWINGSCALE: 1:1
1E42883D
REVDRAWING NUMBERSIZE
NEHALEM-EX HEAT SINK: CU HEAT PIPE
TITLE
PTMI
DEPARTMENT
SEE NOTESSEE NOTES
FINISHMATERIAL mm/dd/yyX DATEAPPROVED BY mm/dd/yyX 08/21/07KALISZEWSKI DATECHECKED BY 05/17/07C. BEALL DATEDRAWN BY 8/21/07C. BEALL DATEDESIGNED BY
UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5-1994 DIMENSIONS ARE IN MM TOLERANCES: .X # 0.5 Angles # 0.5 $ .XX # 0.25 .XXX # 0.125
THIRD ANGLE PROJECTION
PARTS LIST
DESCRIPTIONPART NUMBERITEM NOQTY
NEHALEM-EX HEAT SINK: CU HEAT PIPEE42883-001TOP
REVISION HISTORY
ZONE REV DESCRIPTION DATE APPROVED
- 1 RELEASED FOR TOOLING 4/23/08 JK
THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.
NOTES UNLESS OTHERWISE SPECIFIED: 1. HEAT PIPE INTERFACE FEATURES TO BE CONTROLLED BY SUPPLIER. 2. HEAT PIPE GEOMETRY TO BE CONTROLLED BY SUPPLIER TO MEET ASSEMBLY PRINT REQUIREMENTS. 3. HEAT PIPE BASE MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT A) TYPE: COPPER ALLOY (REPORT ALLOY IN FAI STUDY) B) MINIMUM THERMAL CONDUCTIVITY: 390 W/mK C) WICK: SINTERED POWDER
SECTION A-A
Intel® Xeon® Processor E7 V2 Product Family- HEAT SINK CU HEAT PPE