Guide

Thermal and Mechanical Design
Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family 47
Thermal/ Mechanical Specifications and Design Guide
2.2.6 Thermal Interface Material (TIM)
Applying thermal interface material between the processor IHS and the Heatsink base
will improve the heat transfer between the IHS and the heatsink. Honeywell* PCM45F
material is selected for use with the Intel reference heatsink design.
The recommended size ensures adequate coverage at the interface between the
processor IHS and heatsink pedestal.
Refer to the TIM manufacturer’s guidelines for specifications and handling instructions.
2.3 Thermal Design Guidelines
2.3.1 Intel
®
Turbo Boost Technology
Additional information regarding processor thermal features is contained in the
processor datasheet.
Intel
®
Turbo Boost Technology available on certain processor SKUs, opportunistically,
and automatically, allows the processor to run faster than the marked frequency if the
part is operating below its power, temperature and current limits.
Heatsink performance (lower Ψ
CA
as described in Table 2-12) is one of several factors
that can impact the amount of Intel Turbo Boost Technology frequency benefit. Other
factors are operating environment, workload and system design. Intel Turbo Boost
Technology performance is also constrained by ICC, and VCC limits.
Increased IMON accuracy may provide more Intel Turbo Boost Technology benefit on
TDP limited applications, as compared to lower Ψ
CA
, as temperature is not typically the
limiter for these workloads. See VR12/IMVP7 Pulse Width Modulation (PWM) Product-
Specification and VR12.5 Pulse Width Modulation (PWM) Haswell Input VR Enabling–
Product Specification for more information regarding IMON accuracy.
With Intel Turbo Boost Technology enabled, the processor may run more consistently at
higher power levels (but still within TDP), and be more likely to operate above
TCONTROL, as compared to when Intel Turbo Boost Technology is disabled. This may
result in higher acoustics.
Intel Turbo Boost Technology is a feature available on certain processor SKUs that
opportunistically, and automatically allow the processor to run faster than the marked
frequency if all of the following conditions are met:
1. Processor operating at Base Frequency (that is, P1 P-state)
2. Power management not active (that is, not throttling)
3. Processor operating below its temperature limit (that is, DTS < 0)
4. Processor operating below its power and current limits (that is, < TDP and
<I
CC_MAX
).
Table 2-13. TIM Specification
Parameter Value Unit Notes
TIM Size 35x35x0.25 mm
Dimensions applies to Honeywell* PCM45F p/n:
G34186
PCM45F Activation Load 125 N
Load required to meet min. TIM pressure
(15 psi)