Datasheet

Dual-Core Intel
®
Xeon
®
Processor 7000 Series Datasheet 3
Contents
1 Introduction.......................................................................................................................11
1.1 Terminology.........................................................................................................12
1.2 Reference Documents.........................................................................................14
1.3 State of Data .......................................................................................................14
2 Electrical Specifications....................................................................................................15
2.1 Front Side Bus and GTLREF ..............................................................................15
2.1.1 Front Side Bus Clock and Processor Clocking.......................................15
2.1.2 Front Side Bus Clock Select (BSEL[1:0])...............................................16
2.1.3 Phase Lock Loop (PLL) Power and Filter...............................................17
2.2 Voltage Identification (VID)..................................................................................17
2.3 Reserved, Unused, and TESTHI Pins.................................................................20
2.4 Mixing Processors...............................................................................................20
2.5 Front Side Bus Signal Groups.............................................................................21
2.6 GTL+ Asynchronous Signals and AGTL + Asynchronous Signals......................22
2.7 Test Access Port (TAP) Connection....................................................................23
2.8 Absolute Maximum and Minimum Ratings..........................................................23
2.9 Processor DC Specifications...............................................................................24
2.9.1 Flexible Motherboard (FMB) Guidelines.................................................24
2.9.2 Vcc Overshoot Specification ..................................................................28
3 Mechanical Specifications................................................................................................33
3.1 Package Mechanical Drawing .............................................................................33
3.2 Processor Component Keepout Zones ...............................................................36
3.3 Package Loading Specifications .........................................................................36
3.4 Package Handling Guidelines .............................................................................37
3.5 Package Insertion Specifications ........................................................................37
3.6 Processor Mass Specifications ...........................................................................37
3.7 Processor Materials.............................................................................................37
3.8 Processor Markings.............................................................................................38
3.9 Processor Pin-Out Coordinates...........................................................................39
4 Pin Listing.........................................................................................................................41
4.1 Dual-Core Intel Xeon Processor 7000 Series Pin Assignments..........................41
4.1.1 Pin Listing by Pin Name .........................................................................41
4.1.2 Pin Listing by Pin Number......................................................................50
5 Signal Definitions..............................................................................................................59
5.1 Signal Definitions.................................................................................................59
6 Thermal Specifications.....................................................................................................67
6.1 Package Thermal Specifications.........................................................................67
6.1.1 Thermal Specifications...........................................................................67
6.1.2 Thermal Metrology .................................................................................70
6.2 Processor Thermal Features...............................................................................70
6.2.1 Thermal Monitor .....................................................................................70