Hub Datasheet

Intel
®
E7505 Chipset MCH Datasheet 183
Ballout and Package Information
Ballout and Package Information 7
This chapter provides the ballout and mechanical specifications for the E7505 chipset MCH. This
information is intended to help with component placement and board routing.
7.1 Ballout Assignment
Figure 7-1 is a footprint of the package ballout showing the layout coordinates for the component
balls and general ballout location of the MCH interfaces. Figure 7-2 and Figure 7-3 provide the
ballout footprint listing the signal names by ball number. Table 7-1 provides the ballout listed
alphabetically by signal name. Table 7-2 provides the ballout listed by ball number.
.
Figure 7-1. MCH Ballout Showing 1005 Pins (Top View)
AN
AM
AL
AK
AJ
AH
AG
AF
AE
AD
AC
AB
AA
Y
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
AN
AM
AL
AK
AJ
AH
AG
AF
AE
AD
AC
AB
AA
Y
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
101620
3579
111315
19
4618 81214
22
21
24
23
26
25
28
27
30
29
31
32
33
1
2
17
1016
20
3579
111315
19
46
18
8
1214
22
21
24
23
26
25
28
27
30
29
31
32
33
1
2
17
DDR
B
AGP
HI_A
DDR
A
System
Bus
HI_B