Guidelines

Introduction
R
Intel
®
E7500 MCH Thermal and Mechanical Design Guidelines 9
1.2 Definition of Terms
Term Definition
BGA Ball Grid Array. A package type defined by a resin-fiber substrate, onto which a die is
mounted, bonded and encapsulated in molding compound. The primary electrical
interface is an array of solder balls attached to the substrate opposite the die and
molding compound.
ICH3-S I/O Controller Hub. The chipset component that contains the primary PCI interface, LPC
interface, USB, ATA-33, and other legacy functions.
MBGA Mini Ball Grid Array. A version of the BGA with a smaller ball pitch.
MCH Memory Controller Hub. The chipset component that contains the processor interface
and the memory interface.
FC-BGA Flip Chip Ball Grid Array. A packaging technology used for the MCH.
P64H2 Bus Controller Hub. The chipset component that interfaces the PCI-X buses.
T
case-nhs
The maximum package case temperature without any package thermal solution. This
temperature is measured at the geometric center of the top of the package case.
T
die-nhs
The maximum die temperature without any package thermal solution. This temperature
is measured at the geometric center of the top of the package die.
T
die-hs
The maximum die temperature with the reference thermal solution attached. This
temperature is measured at the geometric center of the top of the package die.
TDP Thermal Design Power. Thermal solutions should be designed to dissipate this target
power level.