Guide

5 Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family
Thermal/ Mechanical Specifications and Design Guide,
D-3 Processor Package Mechanical Drawing (Sheet 3 of 3) ...............................................80
F-1 Socket Mechanical Drawing (Sheet 1 of 4)................................................................86
F-2 Socket Mechanical Drawing (Sheet 2 of 4)................................................................87
F-3 Socket Mechanical Drawing (Sheet 3 of 4)................................................................88
F-4 Socket Mechanical Drawing (Sheet 4 of 4)................................................................89
G-1 PCB Primary Side Keep-out Zone for LGA2011-1 Socket - G26770 Rev 2......................92
G-2 PCB Primary Side Keep-out Zone for Heatsink - G26773 Rev 1....................................93
G-3 PCB Primary Side Keep-out Zone for ILM - G26772 Rev 1........................................... 94
G-4 PCB Secondary Side Keep-out Zone for Back Plate - G26769 Rev 1 ............................. 95
G-5 ILM Volumetric Keep-out Drawing - G52827 Rev A....................................................96
G-6 ILM Mechanical Drawing - G56693 Rev 2 (Sheet 1 of 4)............................................. 97
G-7 ILM Mechanical Drawing - G56693 Rev 2 (Sheet 2 of 4)............................................. 98
G-8 ILM Mechanical Drawing - G56693 Rev 2 (Sheet 3 of 4)............................................. 99
G-9 ILM Mechanical Drawing - G56693 Rev 2 (Sheet 4 of 4)........................................... 100
G-10 Processor 4U Heatsink Assembly Drawing - G48321 Rev 1 ....................................... 101
G-11 Processor 4U Heatsink Assembly Drawing - G20942 Rev E ....................................... 102
G-12 Processor 4U Heatsink Base Mechanical Drawing - G20943 Rev C.............................. 103
G-13 Processor 4U Heatsink Heatpipe Mechanical Drawing - E42883 Rev 1......................... 104
G-14 Processor 4U Heatsink Stiffener Mechanical Drawing - G45952 Rev C ........................ 105
G-15 Processor 4U Heatsink Base Cap Mechanical Drawing - E95299 Rev A........................ 106
G-16 Processor 4U Heatsink Top Fin Mechanical Drawing - G20945 Rev D.......................... 107
G-17 Processor 4U Heatsink Bottom Fin Mechanical Drawing - G20944 Rev D..................... 108
G-18 Processor Heatsink Fastener Mechanical Drawing - E91775 Rev B.............................. 109
G-19 Processor Heatsink Spring Mechanical Drawing - E86113 Rev C ................................ 110
G-20 Processor Heatsink Fastener Retainer Mechanical Drawing - G13624 Rev A................. 111
G-21 Processor Heatsink Retaining Ring Mechanical Drawing - E75155 Rev C ..................... 112
Tables
1-1 Reference Documents ...........................................................................................11
1-2 Terms and Descriptions .........................................................................................12
2-1 Processor Mechanical Parameters............................................................................15
2-2 Processor Materials...............................................................................................16
2-3 LGA2011-1 Socket Attributes .................................................................................17
2-4 Socket PnP Cover Insertion/Removal.......................................................................20
2-5 Socket Loading and Deflection Specifications............................................................21
2-6 Critical-to-Function Interface Dimensions.................................................................22
2-7 ILM and Heatsink Mechanical Load Specifications ......................................................29
2-8 ILM Back Plate Design Criteria................................................................................35
2-9 ILM Assembly Component Thickness and Material .....................................................36
2-10 Processor SKU Thermal Profiles ..............................................................................41
2-11 Averaging Coefficients...........................................................................................45
2-12 Heatsink Boundary Conditions and Performance Targets ............................................45
2-13 TIM Specification ..................................................................................................47
2-14 Fan Speed Control, TCONTROL and DTS Relationship.................................................48
2-15 Thermal Solution Performance Design Targets and Environment .................................51
2-16 Socket and Retention Component Mass....................................................................54
2-17 2011-land Package and LGA2011-1 Socket Stack-up Height ....................................... 55
2-18 Recommended Land Pattern for LGA2011-1 Socket ................................................... 58
2-19 Processor Boundary Conditions and Performance Targets...........................................59
2-20 Tower Heatsink Design..........................................................................................60
A-1 Processor Enabling Components .............................................................................63
B-1 Typical Stress Tests ..............................................................................................70
C-1 Supplier Listing ....................................................................................................74
D-1 Socket Drawing List ..............................................................................................77