Guide

Thermal and Mechanical Design
Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family 39
Thermal/ Mechanical Specifications and Design Guide
2.1.6 Heatsink Mechanical Requirements
The mass of the heatsink should not exceed 600 g. The heatsink mass limit and the use
of a back plate have eliminated the need for Direct Chassis Attach retention in some
implementations. Direct contact between back plate and chassis pan will help minimize
board deflection during shock.
2.2 Thermal Specifications
The processor requires a thermal solution to maintain the die temperature within its
operating limits. Any attempt to operate the processor outside these limits may result
in permanent damage to the processor and potentially other components within the
system, see “Storage Conditions Specifications” section of the processor
datasheet. Maintaining the proper thermal environment is key to reliable, long-term
system operation.
Figure 2-23. Opening Sequence
Open Hinge
Lever First
Open Active
Lever Second