Guidelines

Reference Thermal Solution 2
34 Intel
®
7500 Chipset Thermal Mechanical Design Guide
Note: Assumed 20.5% power through board at high fan speed and 25.7% power through
board in acoustic condition.
7.3 Mechanical Design Envelope
While each design may have unique mechanical volume and height restrictions or
implementation requirements, the height, width, and depth constraints typically placed
on the Intel 7500 chipset thermal solution are shown in Figure 7-2.
When using heatsinks that extend beyond the IOH reference heatsink envelope shown
in Figure 7-2, any motherboard components placed between the heatsink and
motherboard cannot exceed 1.6 mm (0.063 in.) in height.
Figure 7-1. Short Torsional Clip Heatsink Measured Thermal Performance versus
Approach Velocity