Guidelines

Reference Thermal Solution
28 Intel
®
7500 Chipset Thermal Mechanical Design Guide
6.5.1 Heatsink Orientation
Since this solution is based on a unidirectional heatsink, mean airflow direction must be
aligned with the direction of the heatsink fins.
6.5.2 Extruded Heatsink Profiles
The reference thermal solution uses an extruded heatsink for cooling the IOH.
Figure 6-6 shows the heatsink profile. Appendix A lists a supplier for this extruded
heatsink. Other heatsinks with similar dimensions and increased thermal performance
may be available. Full mechanical drawing of this heatsink is provided in Appendix B.
6.5.3 Mechanical Interface Material
There is no mechanical interface material associated with this reference solution.
6.5.4 Thermal Interface Material
A thermal interface material (TIM) provides improved conductivity between the die top
surface and heat sink. The reference thermal solution uses Honeywell PCM45 F*, 0.25
mm (0.010 in.) thick, 20mm x 20mm (1.0 in. x 1.0 in.) square.
Note: Unflowed or “dry” Honeywell PCM45 F has a material thickness of 0.010 inch. The
flowed or “wet” Honeywell PCM45F has a material thickness of ~0.003 inch after it
reaches its phase change temperature.
Figure 6-5. Tall Torsional Clip Heatsink Assembly
D79046-004
E12029-001
TIM
D79046-004
E12029-001
TIM
D79046-004
E12029-001
TIM
Assembly: E12030-007