Guidelines
Intel
®
7500 Chipset Thermal Mechanical Design Guide 23
Reference Thermal Solution
6 Reference Thermal Solution
Intel has developed reference thermal solutions to meet the cooling needs of the Intel
7500 chipset under operating environments and specifications defined in this
document. This section describes the overall requirements for the tall torsional clip
heatsink reference thermal solution including critical-to-function dimensions, operating
environment, and validation criteria. Other chipset components may or may not need
attached thermal solutions depending on your specific system local-ambient operating
conditions.
6.1 Operating Environment
On Intel Itanium processor 9300 series platform, the reference thermal solution was
designed assuming: under the high fan speed condition, a maximum local-ambient
temperature of 53°C and the minimum recommended airflow velocity through the
cross-section of the heatsink fins is 2.2 m/S; Under the acoustic fan speed condition, a
maximum local-ambient temperature of 51°C and the minimum recommended airflow
velocity through the cross-section of the heatsink fins is 1.5 m/S.
On Intel Xeon processor 7500 series-based platform the reference thermal solution was
designed assuming: under the high fan speed condition, a maximum local-ambient
temperature of 52°C and the minimum recommended airflow velocity through the
cross-section of the heatsink fins is 2 m/S; Under the acoustic fan speed condition, a
maximum local-ambient temperature of 57°C and the minimum recommended airflow
velocity through the cross-section of the heatsink fins is 1 m/S.
The approaching airflow temperature is assumed to be equal to the local-ambient
temperature. The thermal designer must carefully select the location to measure
airflow to obtain an accurate estimate. These local-ambient conditions are based on a
35°C external-ambient temperature at 900m altitude. (External-ambient refers to the
environment external to the system.)
Note: The heat sink was designed considering all the boundary conditions in Figure 6-1 but
only the worst one (Intel Xeon processor 7500 series-based platform Acoustic) would
have been used to design the heat sink.
Table 6-1. Intel
®
Xeon
®
Processor 7500 Series-based Platform and
Intel
®
Itanium
®
Processor 9300 Series Platform Operating Conditions
Intel
®
Xeon
®
Processor 7500
Series-based Platform
Intel
®
Itanium
®
Processor 9300
Series Platform
Acoustic High Speed Acoustic High Speed
Velocity (m/sec) 1 2 1.5 2.2
Altitude (m) 900 900 900 900
Tsystem_ambient °C 25 35 25 35
Trise °C 32 17 26 18
Tla °C 57 52 51 53