Guide

Thermal and Mechanical Design
46 Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family
Thermal/ Mechanical Specifications and Design Guide
2. Local ambient temperature of the air entering the heatsink.
3. Defined as (T
CASE_MAX
- T
LA
) / TDP
4. Reference system configuration. 1U = 1.75”.
5. Dimensions of heatsink do not include socket or processor.
6. Heatsink performance value (
Ψ
CA_MAX
) includes TIM performance.
7. Values are preliminary and subject to change.
2.2.5 Socket Maximum Temperature
The power dissipated within the socket is a function of the current at the pin level and
the effective pin resistance. To ensure socket long term reliability, Intel defines socket
maximum temperature using a via on the underside of the motherboard. Exceeding the
temperature guidance may result in socket body deformation, or increases in thermal
and electrical resistance which can cause a thermal runaway and eventual electrical
failure. The guidance for socket maximum temperature is listed below:
• Via temperature under socket < 75°C
• The specific via used for temperature measurement is located on the bottom of the
motherboard between pins BC1 and BE1. See Figure 2-25.
The socket maximum temperature is defined at Thermal Design Current (TDC). In
addition, the heatsink performance targets and boundary conditions must be met to
limit power dissipation through the socket.
Note: The maximum allowable temperature is dependent on the use conditions for the
LGA2011-1 socket. See Appendix B for more information on determining use
conditions.
To measure via temperature:
1. Drill a hole through the back plate at the specific via defined above.
2. Thread a T-type thermocouple (36 - 40 gauge) through the hole and glue it into the
specific via on the underside of the motherboard.
3. Once the glue dries, reinstall the back plate and measure the temperature.
Figure 2-25. Socket Temperature Measurement Location