Vol 1

Intel® Xeon® Product 2800/4800/8800 v2 Product Family 57
Datasheet Volume One, February 2014
Thermal Management Specifications
4.1.4 Thermal Metrology
The minimum and maximum case temperatures (T
CASE
) specified in Table 4-3 through
Table 4-7 are measured at the geometric top center of the processor integrated heat
spreader (IHS). Figure 4-11 illustrates the location where T
CASE
temperature
measurements should be made. For detailed guidelines on temperature measurement
methodology, refer to the Intel® Xeon® Product 2800/4800/8800 v2 Product
FamilyIntel® Xeon® Product 2800/4800/8800 v2 Product Family Thermal/Mechanical
Design Guide.
Notes:
1. Figure is not to scale and is for reference only.
2. See the processor package mechanical drawing for the dimensions of the features.
70 61.7 66.3 70.3 73.7
75 62.6 67.6 71.9 75.4
80 63.5 68.8 73.4 77.2
85 64.4 70.0 74.9 79.0
90 65.3 71.3 76.4 80.7
95 66.2 72.5 78.0 82.5
100 67.1 73.8 79.5 84.2
105 68.0 75.0 81.0 86.0
Table 4-7. 105W Thermal Profile Table (Sheet 2 of 2)
Power (W) Max T
CASE
(°C)
Max 12/15 Core DTS
(°C)
Max 8/10 Core DTS
(°C)
Max 6Core DTS
(°C)
Figure 4-11. Case Temperature (T
CASE
) Measurement Location