Guide

LGA2011-1 Socket Electrical
Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family 83
Thermal/ Mechanical Specifications and Design Guide
E.3 Dielectric Withstand Voltage
No disruptive discharge or leakage greater than 0.5 mA is allowed when subjected to
360 V RMS. The sockets shall be tested according to EIA-364, Test Procedure 20A,
Method 1. The sockets shall be tested in fully mated condition. Barometric pressure
shall be equivalent to Sea Level. The sample size is 25 contact-to-contact pairs on each
of four sockets. The contacts shall be randomly chosen.
E.4 Insulation Resistance
The Insulation Resistance shall be greater than 800 MΩ when subjected to 500 V DC.
The sockets shall be tested according to EIA-364, Test Procedure 21. The sockets shall
be tested in unmounted and unmated. The sample size is 25 contact-to-contact pairs
on each of 4 sockets. The contacts shall be randomly chosen.
E.5 Contact Current Rating
Measure and record the temperature rise when the socket is subjected to rate current
of 0.8 A. The sockets shall be tested according to EIA-364, Test Procedure 70 A, Test
Method 1.
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