Guide

Thermal and Mechanical Design
Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family 55
Thermal/ Mechanical Specifications and Design Guide
2.4.4.3 Package/Socket Stack-up Height
Table 2-17 provides the stack-up height of a processor in the 2011-1-land LGA package
and LGA2011-1 socket with the ILM closed and the processor fully seated in the socket.
Notes:
1. This data is provided for information only, and should be derived from: (a) the height of the socket seating
plane above the motherboard after reflow, given in Appendix F, (b) the height of the package, from the
package seating plane to the top of the IHS, and accounting for its nominal variation and tolerances that
are given in the corresponding processor datasheet.
2. This value is a RSS calculation at 3 Sigma
2.4.5 PCB Design Consideration
2.4.5.1 Allowable Board Thickness
The components described in this document (namely ILM, back plate and heatsink) will
support board thickness in the range of 2.36 - 3.3 mm (0.093" - 0.130"). Boards
(PCBs) not within this range may require modifications to the back plate and heatsink
retention.
2.4.5.2 Board Layout
Assumed 4x1 board configuration
2.4.5.3 Board Keep-outs
Each of the components described in this document require an area beyond its physical
size to accommodate components movement such as ILM levers. In identifying the
board keep-outs one should also consider board and system assembly process and
tools. As a reference, recommended board keep-outs drawings (PCB top and bottom
side) for the LGA2011-1 socket, ILM, and heatsink are made available in Appendix G.
PCB keep-outs includes ILM attach hole locations and sizes, components height limits in
vicinity of the socket and ILM, as well as recommended area to allow access to ILM and
socket for processor installation
2.4.5.4 Suggested Silkscreen Marking for Socket Identification
Intel is recommending that customers mark the socket name approximately where
shown in Figure 2-28.
Table 2-17. 2011-land Package and LGA2011-1 Socket Stack-up Height
Description Height
Integrated Stackup Height (mm) From Top of Board to Top of IHS
(Accounting for Intel Xeon processor E7-2800/4800/8800 V2 product
family and future socket compatible processor package heights)
8.091 ± 0.221 mm
Integrated Stackup Height
(mm) From Top of Board to Top of IHS
(Intel Xeon processor E7-2800/4800/8800 V2 product family only)
8.051 ± 0.200 mm