Guide

Thermal and Mechanical Design
Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family 25
Thermal/ Mechanical Specifications and Design Guide
•Stroke/Load
The minimum vertical height of the contact above the package seating plane is defined
in Appendix F. The minimum vertical stroke of the contact must, under all tolerance
and warpage conditions, generate a normal force load to ensure compliance with all
electrical requirements of the socket defined in Appendix E. The cumulative normal
force load of all contacts must not exceed the load limits defined in Table 2-5.
2.1.2.4.8 Contact/Pad Mating Location
All socket contacts should be designed such that the contact tip lands within the
substrate pad boundary before any actuation load is applied and remains within the
pad boundary at final installation after actuation load is applied.
The offset between LGA land center and solder ball center is defined in Figure 2-10.
Note: It is recommended that the center of the contact landing zone coincides with the
processor pad center.
Note: All dimensions are in mm.
Figure 2-10. Offset between LGA Land Center and Solder Ball Center